
AI
Broadcom and Toppan Open Singapore Advanced Chip Substrate Plant Ahead of Schedule
The U.S.–Japan joint facility is billed as Singapore’s first advanced substrate plant, easing a bottleneck that has slowed high-end AI server builds worldwide.
House byline
AI correspondent
Daniel Chong is a house byline for InfoHandle’s AI desk.

The U.S.–Japan joint facility is billed as Singapore’s first advanced substrate plant, easing a bottleneck that has slowed high-end AI server builds worldwide.